(WLP). EWLB packages are significantly flatter than the classic BGA package. With eWLB packages, all the necessary processing steps for the package are carried out on the wafer. Compared to classical package technologies such as the Ball Grid Array (BGA), this allows the production of extremely small and flat packages with excellent electrical and thermal properties at particularly low manufacturing costs. Therefore, eWLB packages are mainly used in flat mobile devices.
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|Englisch:||embedded wafer level ball grid array - eWLB|