dual inline (package) (DIL)
The socket designations and chip packages Dual Inline (DIL) and Dual Inline Package( DIP) are largely used identically.
Packages in DIL format or in DIP format used to be the most common packages for memory devices, amplifiers, integrated active and passive circuits and other components such as switches.
The characteristics of a DIL package lie in the arrangement of the connection contacts, which are located on the two long sides of the package. The number and spacing of the contacts is identical on both sides.