(CoF) belong to the DCA techniques. In Direct Chip Attach, the chip can be attached to the substrate or PCB with a flux and bonded
toit via wire bridges. In this bonding technique, called wire bonding, the connection points are located on the top of the chip. Alternatively, the flip-chip technique
can be used. In this technique, the chips have bump pads on the underside of the chip that are bonded to contacts on the printed circuit board. This bonding is called bump bonding or chip bonding.