direct chip attach (chip design) (DCA)
DCA technology, Direct Chip Attach (DCA), is an assembly technique in which packaged chips are placed directly on the substrate or printed circuit board. Chip-on-Board( CoB) and Chip on Flex( CoF) belong to the DCA techniques.
In Direct Chip Attach, the chip can be attached to the substrate or PCB with a flux and bonded to it via wire bridges. In this bonding, called wire bonding, the connection points are on the top of the chip. Alternatively, the flip-chip technique can be used. In this technique, the chips have bump pads on the underside of the chip that are bonded to contacts on the printed circuit board. This bonding is called bump bonding or chip bonding.
The advantage of the DCA technique is the small space requirement, the short run times due to the short connecting wires of the bonding or the absence of connecting wires in the flip-chip technique.