At a certain stage of manufacturing, individual chips are called "die" after they have been sawn out of the wafer with a diamond saw or laser cutter. This process is called dicing
.Dice, which is the plural of "die", are finished but unassembled chips. The dice are positioned individually in modules or packages for further processing, overmolded with a molding compound and then bonded. This is the packaging. There are also dice that are installed directly, without packages. Instead of bonding, such dice can be equipped with contact surfaces and inserted directly into the circuit.