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chip-sized SAW package (CSSP)

Chip-Sized SAW Package (CSSP) is a package technology developed by Epcos that can be used to build the smallest RF filters and RF duplexers with surface acoustic wave (SAW) filters.

CSSP package of an RF filter, photo: Epcos

CSSP package of an RF filter, photo: Epcos

The package sizes (2014) of RF filters have dimensions of just 2.0 x 1.4 mm. With further improved CSSP techniques, even smaller footprints of only 1.4 x 1.1 mm and 1.1 x 0.9 mm (CSSP3) can be achieved.

In the CSSP package, the surface filter is mounted on the ceramic substrate using flip-chip technology. The following development stage of CSSP technology is the Die-Sized SAW Package (DSSP), which enables a further reduction in the size of RF filters and duplexers.

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Englisch: chip-sized SAW package - CSSP
Updated at: 25.07.2012
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Translations: DE