chip-sized SAW package (CSSP)
Chip-SizedSAWPackage (CSSP) is a package technology developed by Epcos that can be used to build ultra-small RF filters and RF duplexers with surface acoustic wave ( SAW) filters.
Package sizes (2014) of RF filters have dimensions as small as 2.0 x 1.4 mm. With further improved CSSP techniques, even smaller footprints of only 1.4 x 1.1 mm and 1.1 x 0.9 mm (CSSP3) can be achieved.
In the CSSP package, the surface filter is mounted on the ceramic substrate using flip- chip technology. The following development stage of CSSP technology is the Die-Sized SAW Package( DSSP), which enables further miniaturization of RF filters and duplexers.