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chip-sized SAW package (CSSP)

Chip-SizedSAWPackage (CSSP) is a package technology developed by Epcos that can be used to build ultra-small RF filters and RF duplexers with surface acoustic wave ( SAW) filters.

CSSP package of an RF filter, photo: Epcos.

CSSP package of an RF filter, photo: Epcos.

Package sizes (2014) of RF filters have dimensions as small as 2.0 x 1.4 mm. With further improved CSSP techniques, even smaller footprints of only 1.4 x 1.1 mm and 1.1 x 0.9 mm (CSSP3) can be achieved.

In the CSSP package, the surface filter is mounted on the ceramic substrate using flip- chip technology. The following development stage of CSSP technology is the Die-Sized SAW Package( DSSP), which enables further miniaturization of RF filters and duplexers.

Informations:
Englisch: chip-sized SAW package - CSSP
Updated at: 25.07.2012
#Words: 104
Links: package, surface acoustic wave (SAW), surface acoustic wave (SAW), indium (In), filter
Translations: DE
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