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bond pad

In the fabrication of chips, the chip core, called the dice, is provided with bonding points to which the microfine bonding wires of 12.5 µm to 50 µm diameter are welded during bonding. Depending on the application, the bond wires can be made of gold, silver, copper

or aluminum.

Bond pads on the classic 8008

Bond pads on the classic 8008

The bonding points are the bond pads. The size of the bond pads depends on the chip technology and integration density. Whereas in the past the values were in the micrometer range, in modern integrated circuits they are a few hundred nanometers.

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Englisch: bond pad
Updated at: 30.03.2020
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