Package-Abkürzungen

Übersicht über gebräuchliche Abkürzungen die die Bauart und Bauform von analogen und digitalen Chips betrifft:

Antifuse Actel FPGAs

BCA Bare Chip Attach

BCP Bare Chip Processing

BCC Bump Chip Carrier

BEM Boundary Element Method

BGA Ball Grid Array

BTAB Bumped Tape Automated Bonding

C&P Collect and Place

C&W Chip and Wire

C4 Controlled Collapse Chip Connection

C5 Controlled Collapse Chip Connection on Ceramic

CARD Card Memory

CBGA Ceramic Ball Grid Array

CCGA Ceramic column grid array

CDIP Ceramic Dual Inline Package

CDIP SB Side-Braze Ceramic Dual Inline Package

CERDIP Ceramic DIP

CERPACK Ceramic Package

CFP Both Formed and Unformed CFP

CLCC Ceramic Leaded Chip Carrier

COB Chip on Board

COG Chip on Glass

COL Chip on Lead

CPGA Ceramic Pin Grid Array

CPLD Complex Programmable Logic Device

CQFP Ceramic Quad-Flat Package

CSOP C-lead SOP

CSP Chip Scale Package

CSSP Chip-Sized SAW Package

CZIP Ceramic Zig-Zag Package

DBGA Dimpled Grid Array

DCA Direct Chip Attach

DFP Dual Flat Package

DIMM Dual Inline Memory Module

DIP Dual Inline Package

DLA Direct Lid Attach

DO Diode Outline

DPAK Discrete Package

EPLD Erasable PLD

FBGA Fine Ball Grid Array

FC/CSP Flip Chip / Chip Scale Package

FC-PGA Flip Chip Pin Grid Array

FLFP Flat Lead Frame Package

FLGA Fine Land Grid Array

FLEX Altera FPGAs

FCIP Flip Chip in Package

FCOS Flip Chip on Substrate

FP Flat Package

FPFA Fiels Programmable Function Array

FPGA Field Programmable Logic Array

FQFP Fine pitch QFP

HDI High Density Interconnection

HLQFP Thermally Enhanced Low Profile QFP

HQFP Thermally Enhanced Quad Flat Package

HSOP Thermally Enhanced Small-Outline Package

HSSOP Thermally Enhanced Shrink Small-Outline Package

HTQFP Thermally Enhanced Thin Quad Flat Pack

HTSSOP Thermally Enhanced Thin Shrink Small-Outline Package

HVQFP Thermally Enhanced Very Thin Quad Flat Package

ILB Inner Lead Bonding

IPAK Integrated Package

JLCC J-Leaded Ceramic or Metal Chip Carrier

LCA Xilinx Logic Cell Array

LCC Leaded Chip Carrier

LCCC Leadless Ceramic Chip Carrier

LDCCC Leaded Ceramic Chip Carrier

LFCSP Leadframe Chip Scale Package

LGA Land Grid Array

LID Leadless Inverted Device

LIF Low Insertion Force

LLC Leadless Chip Carrier

LLP Leadless Leadframe Package

LPCC Leadless Plastic Chip Carrier

LPCVD Low Pressure CVD

LQFP Low Profile Quad Flat Pack

LSI Large Scale Integration

LTCC Low Temperature Cofired Ceramic

MACH AMD MACH family of CPLDs

MAX Altera CPLDs

MC Multilayer Ceramic

MCM Multi-Chip Module

MCP Multi-Chip Package

MEFL Metal Electrode Leadless Face

MID Molded Interconnect Device

MLC Multi Layer Ceramic

MLF Micro Lead Frame

MLP Micro Leadframe Package

MLPD Micro Leadframe Package Dual

MLPM Micro Leadframe Package Micro

MLPQ Micro Leadframe Package Quad

MMC Mobile Module Cartridge

MPS Micro Packaging System

MQFP Metal Quad Flat Package

MSI Medium Scale Integration

MSOP Micro Small-Outline Package

MSP Mini Square Package

OTP One Time Programmable

OPTO Light Sensor Package

PBGA Plastic BGA

PGA Pin Grid Array

PDIP Plastic Dual-Inline Package

PFM Plastic Flange Mount Package

PLCC Plastic Leaded Chip Carrier

PLD Programmable Logic Device

PoP Package on Package

PPGA Plastic Pin Grid Array

PQFN Power Quad Flat No-lead

PQFP Plastic Quad Flat Package

PSGA Polymer Stud Grid Array

PSO Plastic Small Outline

QCP Quad Carrier Package

QFJ Quad Flat J-lead

QFN Quad Flat No-lead

QFP Quad Flat Package

QUIL Quad in-Line

QUIP Quad in-Line Package

SCP Single Chip Packaging

SDIP Shrink Dual-Inline Package

SEC Single Edge Contact

SECC Single Edge Contact Cartridge

SEPP Single Edge Processor Package

SHP Surface Horizontal Package

SIL Single Inline

SIMM Single Inline Memory Module

SIP Single-Inline Package

SiP System in Package

SIPP Single Inline Pinned Package

SLC Surface Laminar Circuit

SMD Surface Mounted Device

SO Small Outline

SoC System on Chip

SOD Small outline diode package

SODIMM Small Outline Dual-Inline Memory Module

SOIC Small Outline Integrated Circuit

SOJ J-Leaded Small-Outline Package

SOP Small-Outline Package (Japan)

SOT Small Outline Transistor

SPGA Pin Grid Array

SQFP Shrink Quad Flat Package

SSI Small Scale Integration

SSOP Shrink Small-Outline Package

TCP Tape Carrier Package, 320pin

TEP Top Exposed Pad

TFBGA Thin Fine-Pitch Ball Grid Array

TFP Triple Flat Pack

TO Transistor Outline

TOS Tape on Substrate

TQFP Thin Quad Flat Package

TSOJ Thin Small Outline J-leaded Package

TSOP Thin Small-Outline Package

TSSOP Thin Shrink Small-Outline Package

TVFLGA Thin Very-Fine Land Grid Array

TVSOP Very Thin Small-Outline Package

UCSP Wafer Chip Scale Package

UFP Ultra Fine Pitch

ULSI Ultra Large Scale Integration

URM Universal Retention Module

VFBGA Very-Thin Fine-Pitch Ball Grid Array

VLSI Very Large Scale Integration

VQFP Very Thin Quad Flat Package

VSO Very Small Outline

VSoC Vision System on Chip

VSOP Very Small Outline Package

WCSP Wafer Chip Scale Package

WLP Wafer Level Package

WLCSP Wafer-Level Chip Scale Package

ZIF Zero Insertion Force

ZIP Zig Zag in-Line Package

µPGA Micro PGA